Events

System in Package (SiP) Integration for Wireless Applications

Date: 03 May 2004 - 03 May 2004

Venue: SIMTech, Auditorium, Tower Block, Level 3

Abstract

With the emergence of the wireless technology for high speed communication products, established technologies in packaging are not sufficient to handle the increasing demands of high performance, lower product cost and miniaturisation. These demands result in new packaging challenges such as integration issues, cost performance and product manufacturability.

Speakers
Speakers include Richard Gruenwald, Director, EPCOS, Dr Mihai Rotaru, Senior Research Engineer, Institute of Microelectronics (IME), Dr Albert Lu, Research Scientist, SIMTech. 

Mr Richard Gruenwald is the Director for Product Development at EPCOS Pte Ltd Singapore, Surface Acoustic Wave Components Division. He joined EPCOS (formerly known as Siemens Matsushita Components) in 1996. Since then, Mr Gruenwald has held various different R&D-related (SAW products) responsibilities in EPCOS Munich, Germany. He obtained a Diplom-Ingenieur degree from Technical University of Munich.

Dr Mihai Rotaru is a Senior Research Engineer of the Institute of Microelectronics Singapore, Microsystems, Modules and Components Laboratory. Presently, he is involved in designing, modelling and characterisation of System in Package solutions for wireless applications as well as electromagnetic modelling of 3 dimensional stack modules. His professional interests include efficient modelling techniques for complex electromagnetic problems and system in package integration solution for RF front end. Dr Rotaru is a member of IEEE. Dr

Albert Lu is a Research Scientist with the Joining Technology Group at Singapore Institute of Manufacturing Technology (SIMTech). He spearheads R&D activities in package design, broadband modelling, signal integrity simulation and high-speed characterisation. He has also initiated and was project leader for major industry collaborations on optical networking, high-performance computing and next-generation wireless applications including the High Density Substrate Consortium, Broadband Consortium, and Integrated Passives Consortium. As a member of the IEEE CPMT and MTT Societies, Dr Lu was invited speaker for IPC Asia PCB Conference 2002, Cadence High Speed Design Seminar 2002 and 2003. He is an Advisory Board Member for Globaltronics 2004.