3D Carbon Nanotube Network
Carbon nanotubes (CNTs) are one dimensional nanowires with superior electrical, thermal and mechanical properties. They have been considered as the future building block materials for many components within the electronic devices. In particular, with its nano feature size and high resistance to electromigration, CNT is an ideal material for fabricating sub-micro or nano flip chip interconnects with outstanding performance. In this study, a self-assembly fabrication technique for three dimensional (3-D) carbon nanotube network is developed. A network of secondary and tertiary CNTs are successfully synthesized. The aligned primary CNTs bridged with each other to generate the 3-D CNT network.
Micrograph showing the 3-D CNT network.
Contact PersonWei Jun(firstname.lastname@example.org)
Simple assembly technique for CNT bumps leads to the formation of highly electrical conductive structure for flip chip interconnect application. The CNT bumps from top and bottom substrates have shown to adhere well to each other and exhibit low contact resistance. The conductivity of CNT interconnection bump was found to be of many magnitudes higher than that of the silver paste. It was demonstrated that the CNT bumps have a much superior electrical properties over the typical metallic bumps.
BenefitsID-J-07-025: A method for forming three dimensional carbon nanotubes network
Patents / Awards / Achievements / DifferentiationID-J-07-025: A method for forming three dimensional carbon nanotubes network
ApplicationsThe 3-D network has the potential use as an electrocatalyst support for electrode in the electrochemical cell. It can also be incorporated as an additive into conventional materials (e.g. metal, polymer or ceramic-based matrices). It is suitable for micro- and nano-interconnection applications in micro/nanoelectronics, optoelectronics, MEMS/NEMS, hermetic sealing, 3-D IC and systems as well as system-in-package.