Research Projects

Transient Liquid Phase bonding

Transient Liquid Phase Bonding (TLPB) is a two-stage diffusion process that joins metallic materials at a sufficiently low bonding temperature. TLPB process can be adopted for joining bulk material as well as micro-joints. It is ideal for joining materials that are prone to surface oxidation and applications that requires low residual stresses and enhance creep/fatigue properties.



Contact PersonBi Guijun(gjbi@SIMTech.a-star.edu.sg)
Benefits

The key advantages of this technology include:

  • Low bonding temperature as compared to existing soldering/brazing techniques
  • Low residual stresses at the interfaces due to low bonding temperature and pressure application
  • Improved creep & fatigue properties
  • Self-homogenizing; No interface/intermetallic formation for large and complex shapes

However, the implementation of TLPB process remains a challenge for the local industries due to the lack of suitable knowledge and experience. TLPB process requires the understanding on the diffusing fillers as well as post-bond heat treatment for age hardening of different applications. SIMTech has strong expertise in micro-soldering and brazing techniques of dissimilar metal materials for different applications.

Applications

TLPB can be applied to a wide range of micro-joining applications, ranging from micro-actuators used in automotive and precision engineering industries to electronics in aerospace and automotive industries. TLP process can also be applied for joining of large and complex shapes such as aircraft engines.

Publications

S. Zhang, H. B. Su, C. S. Tan, T. K. S. Wong, J. W. Teo: Dielectric relaxation in AC powder electroluminescent devices, Solid State Communications, 2017, Vol. 250, 53-56