Researcher Portfolio

Nai Mui Ling Sharon (Dr)
Senior Scientist I
6793 8976
Forming Technology
Introduction:Jan 2008 - Oct 2008: Research Fellow, Minerals, Metals and Materials Technology Centre, M3TC (Development of advanced tin-based materials)
2002 - 2003: Research Engineer, Singapore Institute of Manufacturing Technology (Microsystems and nanosystems fabrication and packaging, lead-free solder characterization and reliability studies)
Research Interest:
  • Microsystems and nanosystems fabrication and packaging
  • Development of nanocomposite solders
  • Lead-free solder characterization and reliability studies
  • Metal based composites
BioNotes:2008:  PhD, Mechanical Engineering (Materials Division), National University of Singapore
2002:  MEng, Mechanical Engineering (Materials Division), National University of Singapore
2000:  BEng (Hons.), Mechanical Engineering, National University of Singapore
Publications:

Journal

  1. J. Wei, H. Xie, M. L. Nai, C.K. Wong and L.C. Lee, “Low Temperature Wafer Anodic Bonding”, J. Micromechanics and Microengineering, vol. 13, pp. 217-222, (2003).
  2. J. Wei, M. L. Nai, C. K. Wong, Z. Sun and L. C. Lee, “Low Temperature Glass-to-Glass Wafer Bonding”, IEEE Trans. Advanced Packaging, vol. 26(3), pp. 289-294, (2003).
  3. W. B. Yu, C. M. Tan, J. Wei, S. S. Deng and S. M. L. Nai, “Influence of Applied Load on Vacuum Wafer Bonding at Low Temperature“, Sensors and Actuators A, vol. 115, pp. 67-72, (2004).
  4. S. S. Deng, C. M. Tan, J. Wei, W. B. Yu, S. M. L. Nai and H. Xie, “Low-temperature Sol-gel Intermediate Layer Wafer Bonding, Thin Solid Films, vol. 496, pp. 560–565, (2006).
  5. S. M. L. Nai, J. Wei and M. Gupta, "Development of Lead-free Solder Composites Containing Nanosized Hybrid (ZrO2 + 8 mol.% Y2O3) Particulates, Solid State Phenomena, vol. 111, pp. 59–62, (2006).
  6. S. M. L. Nai, J. Wei and M. Gupta, “Improving the Performance of Lead-free Solder Reinforced with Multi-walled Carbon Nanotubes”, Materials Science and Engineering A, vol. 423 (1–2), pp. 166–169, (2006).
  7. S. M. L. Nai, J. Wei and M. Gupta, “Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-free Solder”, J. Electronic Materials, vol. 37 (4), pp. 515-522, (2008).
  8. S. M. L. Nai, J. Wei and M. Gupta, “Using Carbon Nanotubes to Enhance Creep Performance of a Lead-free Solder“, Materials Science and Technology, vol. 24(4), pp. 443–447, (2008).
  9. S. M. L. Nai, J. Wei and M. Gupta, “Interfacial Intermetallic Growth and Shear Strength of Lead-free Composite Solder Joints”, J. Alloys and Compounds, vol. 473(1–2), pp. 100 – 106, (2009).
  10. M. E. Alam, S. M. L. Nai and M. Gupta, “Development of High Strength Sn-Cu Solder Using Copper Particles at Nanolength Scale”, J. Alloys and Compounds, vol. 476(1-2), pp. 199–206, (2009).
  11. S. M .L. Nai, J.V.M. Kuma and M. Gupta, “Utilizing Energy Efficient Microwave Sintering to Significantly Enhance the Tensile Response of a Lead-Free Solder”, J. Phys. D: Appl. Phys., vol. 42, p. 015404, (2009).
  12. P. Babaghorbani, S. M. L. Nai and M. Gupta, “Reinforcements at Nanometer Length Scale and the Electrical Resistivity of Lead-Free Solders”, J. Alloys and Compounds, vol. 478(1-2), pp. 458 – 461, (2009).
  13. P. Babaghorbani, S. M. L. Nai and M. Gupta, “Development of Lead-free Sn-3.5Ag/SnO2 Nanocomposite Solders”, J. Mater. Sci.: Mater. in Electronics, vol. 20, pp. 571 – 576, (2009).
  14. Y. D. Han, H. Y. Jing, S. M. L. Nai, C. M. Tan, J. Wei, L. Y. Xu and S. R. Zhang, “A Modified Constitutive Model for Creep of Sn-3.5Ag-0.7Cu Solder Joints”, J. Phys. D: Appl. Phys, vol. 42, p. 125411, (2009).
  15. J. W. Zheng, S. M. L. Nai, M. –F. Ng, P. Wu, J. Wei and M. Gupta, "DFT Study on Nano Structures of Sn/CNT Complex for Potential Li-ion Battery Application", Journal of Physical Chemistry C, vol. 113(31), pp. 14015 – 14019, (2009).
  16. S. M. L. Nai, J. V. M. Kuma, M. E. Alam, X. L. Zhong, P. Babaghorbani, M. Gupta, "Using Microwave Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High Strength Solder Composites", Journal of Materials Engineering and Performance, vol. 19(3), pp. 335 – 341, (2010).
  17. Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan and J. Wei, “Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-free Solder”, Journal of Electronic Materials, vol. 39(2), pp. 223 – 229, (2010).
  18. Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei, “Indentation Size Effect on the Creep Behavior of a SnAgCu Solder”, International Journal of Modern Physics B (IJMPB), vol. 24 (1 – 2), pp. 267 – 275, (2010).
  19. Naing Naing Aung, Wei Zhou, Chwee Sim Goh, Sharon Mui Ling Nai and Jun Wei, “Effect of Carbon Nanotubes on Corrosion of Mg-CNT Composites”, Corrosion Science, vol. 52, pp. 1551 – 1553, (2010).  

 Conference

  1. J. Wei, M. L. Nai, C. K. Wong, L. C. Lee, “Glass-to-Glass Anodic Bonding Process and Electrostatic Force”, International Conference of Materials for Advanced Technologies (ICMAT 2003), Symposium L, 7 - 12 Dec 2003, Singapore, (2003).
  2. W. B. Yu, C. M. Tan, J. Wei, S. S. Deng and M. L. Nai, “Influence of Plasma Treatment and Cleaning on Vacuum Wafer Bonding”, 5th Electronics Packaging Technology Conference (EPTC), 10 - 12 Dec 2003, Singapore, pp. 294 - 297, (2003).
  3. S. M. L. Nai, J. Wei, P. C. Lim and C. K. Wong, “Silicon-to-Silicon Wafer Bonding with Gold as Intermediate Layer”, 5th Electronics Packaging Technology Conference (EPTC), 10 - 12 Dec 2003, Singapore, pp. 119 - 124, (2003).   
  4. S. S. Deng, C. M. Tan, J. Wei, W. B. Yu, M. L. Nai and G. Y, Huang, “Silicon-to-Silicon Wafer Bonding Efficiency by Sol-gel Processing”, 5th Electronics Packaging Technology Conference (EPTC), 10 - 12 Dec 2003, Singapore, pp. 421 - 424, (2003). 
  5. S. M. L. Nai, J. Wei, C. K. Wong and M. Gupta, “Enhancing the Performance of Sn-Ag-Cu Solder with the Addition of Titanium Diboride Particulates”, ASME IMECE 2004, 13 - 19 Nov 2004, US, (2004).
  6. S. M. L. Nai, M. Gupta and J. Wei, “Synthesis and Characterization of Novel Lead-free Solder Composites”, 13th International Conference on: Processing and Fabrication of Advanced Materials (PFAM13), 6 -8 Dec 2004, , (2004).
  7. S. M. L. Nai, J. Wei and M. Gupta, “Development of Advanced Lead-free solder Based Interconnect Materials Containing Nanosized Y2O3 Particulates”, ASME IMECE 2005, 5 -11 Nov 2005, US, (2005).
  8. S. M. L. Nai, J. Wei and M. Gupta, “Effect of Presence of Carbon Nanotubes on the Wettability and Mechanical Performance of Sn-Ag-Cu Solder”, ASME IMECE 2005, 5 -11 Nov 2005, US, (2005).
  9. S. M. L. Nai, J. Wei and M. Gupta, “Effect of Presence of Multi-walled Carbon Nanotubes on the Creep Properties of Sn-Ag-Cu Solder”, ASME IMECE 2006, 5 -10 Nov 2006, US, (2006).
  10. S. M. L. Nai, M. Gupta and J. Wei, “Influence of Temperature on the Creep Properties of Sn-Ag-Cu Solder Reinforced with Multi-walled Carbon Nanotubes”, International Conference of Materials for Advanced Technologies (ICMAT 2007),  Symposium H, 1 - 6 July 2007, Singapore, (2007).
  11. S. M. L. Nai, J. Wei and M. Gupta, "Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder", ASME IMECE 2007, 11 - 15 Nov 2007, Seattle, USA, (2007).
  12. S. M. L. Nai, M. Gupta and J. Wei, "Suppressing Intermetallic Compound Growth in SnAgCu Solder Joints with Carbon Nanotubes Addition”, IEEE International Nanoelectronics Conference (INEC) 2008, 24 - 27 March 2008, Shanghai, , (2008).
  13. M. Gupta, S. M. L. Nai, C. S. Goh and J. Wei, “Using Carbon Nanotubes to Enhance the Thermal and Mechanical Properties of Metallic Materials”, Materials Science & Technology 2008 (MS&T ’08), 5 - 9 October 2008, Pittsburgh, Pennsylvania, , pp. 2288 - 2297. (Invited Paper)
  14. Y. D. Han, H. Y. Jing, S. M. L. Nai, C. M. Tan, J. Wei,  L. Y. Xu and S. R. Zhang, “A New Creep Model for SnAgCu Lead-Free Composite Solders: Incorporating Back Stress”, 10th Electronics Packaging Technology Conference, 9 - 12 December 2008, Singapore, (2008).    
  15. S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, J. Wei, M. Gupta, “Using Nanoparticles and Carbon Nanotubes to Enhance the Properties of A lead-free Solder”, Nanotech Conference & Expo 2009, 3 - 7May 2009, pp. 538-541, Houston, USA, (2009).
  16. S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, J. Wei, “Enhancing the properties of a SnAgCu solder with the addition of Ni-coated carbon nanotubes”, 2009 International Conference on Electronic Packaging Technology & High Density Packaging, 10– 13 August, 2009, pp. 540-543, Beijing, China, (2009). (Best Paper Award)
  17. J. Wei, S. M. L. Nai, X. F. Ang, K. P. Yung, “Advanced high density interconnect materials and techniques”, 2009 International Conference on Electronic Packaging Technology & High Density Packaging, 10 – 13 August, 2009, pp. 6-13, Beijing, China, (2009). (Keynote paper)
  18. Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei, “Indentation size effect on the hardness of a Sn-Ag-Cu solder”, ASME International Mechanical Engineering Congress and Exposition, 13- 19 November, 2009, Lake Buena Vista, Florida, USA, (2009).
  19. Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei, “Effect of Ni-Coated Carbon Nanotubes on Interfacial Intermetallic Layer Growth”, 11th Electronics Packaging Technology Conference, 9– 11 December 2009, Singapore, (2009).
  20. Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, J. Wei, “Indentation Creep and Hardness of a Sn-Ag-Cu Solder Reinforced with Ni-coated Carbon Nanotubes”, 3rd IEEE International NanoElectronics Conference,  3 – 8 January, 2010, Hong Kong, China, (2010).
Awards:
  • Aug 2009: Best Paper Award at ICEPT-HDP’09 conference
  • 2008: Finalist of IMechE Andrew Fraser Prize
  • Dec 2006:Best Student Poster Award at SEIA ‘06 conference