Introduction:Ms Wan started work as a process engineer in semiconductor backend industry in 1982 and progress to do equipment design and development for the global semiconductor industry since 1984. She had brought to realisation various equipment required in the manufacturing of the many types of IC chips. Her experience in semiconductor back-end equipment includes automated IC handling systems, test handlers, marking and inspection systems, tape and reel systems, etc. For the semiconductor front-end, she had done automated UV curing and cleaning wafer systems and various types of wafer sorting and handling equipment. Besides working with dry-process equipment, since 2005, she had did R&D in wet-process equipment in the electro-plating of semiconductor lead frames, electronic connectors and components, etc. Since 2007, had started into building equipment for R&D purposes for forming technology, like automated liquid forging and spin-forming. Work with researchers on equipment development projects like free-roaming robotic butler, heat-reclaim exchanger, 3D X-ray systems, etc.
Equipment Design Methodology (Modular concept and Risk analysis in equipment design and development)
Automated Equipment System Conceptualisation
Equipment System Trouble-shooting and Debugging methodology
BioNotes:Masters of Science (Precision Engineering), Nanyang Technological University,1999
Masters of Science (Mechanical Engineering), National University of Singapore,1989
Bachelor of Engineering (Mechanical Engineering), National University of Singapore,1982