Researcher Portfolio

Wong Stephen (Dr)
Director - Industry Development Office
Joining Technology
Introduction:Dr Stephen Wong is the Director for Industry Development Office at the Singapore Institute of Manufacturing Technology. He is responsible for formulating industry collaboration strategies and oversees a portfolio of industry-directed R&D projects, knowledge & technology transfers, and consultancy services which enhance manufacturing competitiveness.  He has spearheaded over 10 research consortia with the electronics, aerospace and medical technology industries. Prior to his current role, he was the Group Manager for Electronics Packaging and Multifunctional Substrate Technology and was instrumental in initiating strategic research projects to establish high density substrate and LTCC design & fabrication capabilities, micro-structuring processes on polymer and silicon materials,wafer-level bonding, various bumping techniques and large area printing processes.
Research Interest:Low temperature wafer bonding
Flip-chip under bump metallization scheme and reliability
Compliant interconnection for electronics packaging
Lead-free solder reliability
BioNotes:PhD (Flip-chip Interconnection and Reliability), Nanyang Technological University, 2012
MBA, University of Western Australia, 2001
MSc (Mechanical Engineering), National University of Singapore, 1995
BEng (Mechanical Engineering), University of Nottingham, UK, 1990
Publications:
  • E. H. Wong and C. K. Wong, "Approximate Solutions for the Stresses in the Solder Joints of a Printed Circuit Board Subjected to Mechanical Bending", International Journal of Mechanical Science, vol. 51(1), pp. 152-158 (2009)
  • C. K. Wong, J. H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng and Y. F. Sun, "The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging", Journal of Microelectronics Reliability, vol. 48(4), pp. 611-662 (2008)
  • E. H. Wong and C.K. Wong, "Tri-Layer Structures Subjected to Combined Temperature and Mechanical Loadings", IEEE Transaction on Component Packaging Technology, vol. 31(4), pp. 790-800 (2008)
  • Peter Z. Shi, K.M. Chua, C.K. Wong and Y.M. Tan, "Design & performance optimization of miniature heat pipes in LTCC", Journal of Physics, 34, 142-147, (2006)
  • Q. Zhang, X.C. Shan, G. Guo, S. Wong, "Performance analysis of air bearing in a micro system", Materials Science and Engineering: A, vol. 423(1-2), pp. 225-229 (2006)
  • X.C. Shan, Z.F. Wang, Y.F. Jin, M. Wu, J. Hua, C.K. Wong and R. Maeda, "Studies on a Micro Combustor for Gas Turbine Engines", Journal of Micromechanics and Microengineering, Vol.15, pp215-221, (2005)
  • J. Wei and C. K. Wong, "Physical and chemical nanolithography techniques: challenges and prospects", International Journal of Nanoscience, vol. 4(4), pp. 575-585 (2005)
  • Y. Jin, Z. Wang, L. Zhao, P. Cheng Lim, J. Wei, and C.K. Wong, "Zr/V/Fe thick film for vacuum packaging of MEMS", Journal of Micromechanics and Microengineering, vol.14, pp.687-692 (2004)
  • J. Wei, C. K. Wong, and L.C. Lee, "Improvement of anodic bond quality with the assistance of sputtered amorphous film", Sensors and Actuators A. Journal, 113, 218-225, (2004)
  • J. Wei, S.M.L. Nai, C.K. Wong and L.C. Lee," Glass-to-glass anodic bonding process and electrostatic force", Thin Solid Films Journal, 462-463C, 487-491,(2004)