Introduction:Development of SMT processes in fine-pitch solder paste printing, paste-in-hole; BGA, CSP and flip chip assembly technology development for industry consortium; solder joint reliability testing and studies for electronic assemblies.
Thermal characterization of IC packages and electronic devices
Recent Industry Projects:
1) Flip chip technology development using no-flow underfills for
eutectic and lead-free assemblies
2) Lead-free soldering for wave and reflow process
Research Interest:High density substrate, thin film coatings, flip chip packaging and assembly, lead-free soldering
BioNotes:B.Sc. (Mechanical Engineering), University of Iowa, USA
M.Sc. (Mechanical Engineering), Michigan State University, USA
Publications:1.Peter Collier, Vasudivan Sunappan, Arulvanan Periannan, "Lead-Free Solder Process Implementation for PCB Assembly", APACK 2001.