Researcher Portfolio

Peter Shi Zhaofeng (Mr)
Senior Research Engineer
6590 3152
Precision Engineering Centre of Innovation
Introduction:
  • Singapore Institute of Manufacturing Technology (SIMTech), A*STAR: Peter Shi has been working on thermal management and thermomechanical reliability through various R&D and industry projects, and industry development and training since 1997
  • Light10 Labs PL: He worked on thermal solutions for LED lighting for one year
  • PricewaterhouseCoopers (PwC): He worked as a consultant in asset and business valuation for about two years
  • He has published over 30 journal and conference technical papers
Research Interest:

Thermal & mechanical modeling, simulation, design and charcterization

Reliability assessment of structures, components and materials

BioNotes:

MBA, MEng, MSc, BSc

Publications:M. Ying, S.M.L. Nai, P.Z.F. Shi, J. Wei, C.K. Cheng and B. Lim, “Thermal Management for High Power Light-Emitting Diode Street Lamp”, ASME 2010 International Mechanical Engineering Congress and Exposition, Vancouver, Canada, 12-18 Nov 2010, pp. 49-53

P.Z.F. Shi, P. Arulvanan, and A.C.W. Lu, “Thermal Performance Evaluation of Power SSL Module in LTCC”, 9th Electronics Packaging Technology Conference (EPTC07), Singapore, 2007, pp. 285-288

P.Z.F. Shi, K.M. Chua, S.C.K. Wong, and Y. M. Tan, “Design and performance optimization of miniature heat pipes in LTCC”, 2006 International MEMS Conference, Singapore, 9-12 May 2006, Vol. 34, pp. 142-147

S.H. Ng, Z.F. Wang, P.Z.F. Shi, B.K. Lok, and R.T. Tjeung, “Realization of a Microelectrofluidic Platform”, 2006 International MEMS Conference, Singapore, 9-12 May 2006, Vol. 34, pp. 373-378

P.Z.F. Shi, S.C.K. Wong, Y.M. Tan, S. Vasudivan, W. Fan, and K. M. Chua, :Thermal Simulation and Experimental Validation for TEC Design”, ASME international electronic packaging technical conference and exhibition, San Franciso, 17-22 Jul 2005

Y.M. Tan, W. Fan, K.M. Chua, P.Z.F. Shi, and C.K. Wong, “Fabrication of Thermoelectric Cooler for Device Integration”, 7th Electronics Packaging Technology Conference (EPTC 2005), Singapore, 7-9 Dec 2005, pp. 802-805

P.Z.F. Shi, A.C.W. Lu, Y.M. Tan, S.C.K. Wong, E. Tan, and R. Tan, “Thermal design and experimental validation for optical transmitters”, Microelectronics Reliability, Vol. 44(5), pp. 755-769, (2004)

Q.J. Yang, X.Q. Shi, Z.P. Wang, and P.Z.F. Shi, “Finite element analysis of a PBG assembly under isothermal/mechanical twisting loading”, Finite Elements in Analysis and Design, Vol. 39, pp. 819-833, (2003)

P.Z.F. Shi, A.C.W. Lu, E. Tan, and R. Tan, “Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Optical Module”, IPACK03, Hawaii, 6-11 July 2003

P.Z.F. Shi, A.C.W. Lu, and C.K. Wang, “Thermal Performance Optimisation of Leadless CSP for RFIC Applications”, 3rd International Conference on Thermal and Mechanical Simulation in Microelectronics, Paris, 2002

P.Z.F. Shi, A.C.W. Lu, Y.M. Tan, K.H. Ang, E. Tan, and R. Tan, “Heat Sink Design Optimization for Optical Transponders” 35th International Symposium on Microelelectronics, Denver, 2002

Q.J. Yang, Z.P. Wang, X.Q. Shi, and P.Z.F. Shi, “FE Mesh Density”, APACK Conference 2001, Singapore, 2001

A.C.W. Lu, P.Z.F. Shi, W. Fan, L.L.Wai, C.K.Wang, H.G.Low, and Y.K.Swee, “Design Optimisation of QFN Packages”, Semicon West Proceedings, San Jose, 2001

Q.J. Yang, Z.P. Wang, P.Z.F. Shi, H.L.J. Pang, and C.G. Lim, “Reliability Assessment of a CSP Assembly using a Highly Accelerated Mechanical – Thermal Method”, The 2001 Pacific Rim / International Intersociety, Electronic Packaging Technical Conference, Hawaii, 2001

Q.J. Yang, Z.P. Wang, X.Q. Shi, and P.Z.F. Shi, “Thermo-Mechanical Modeling of a PBGA Assembly - Effect of FE Mesh Density”, APACK’01, Singapore, 2001

Z.P. Wang, Y.M. Tan, C.M. Schreiber, H Feigenbaum, P.Z.F. Shi, and J. Wei, “Low Cost Chip-on-Dot Flip Chip Technique for Unbumped Die”, 3rd Electronics Packaging Technology Conference, 2000 

A.C.W. Lu, D.J. Xie, P.Z.F. Shi, and W.H. Ryu, “Electrical and Thermal Modelling of QFN packages”, 3rd Electronics Packaging Technology Conference, Singapore, 2000

H. Hahnjong and P.Z.F. Shi, “Assembly multi-chip cob module with metal heat sink”, Surface Mount International Conference (SMI'98), San Jose, 1998

Awards:

SIMTech Award in Industry Project, "High Power LED for Mountable Lighting Applications", 2007

Scholarship from Nanyang Technological University from Jul 1995 to Jun 1997