Mr Eugene Kok is a Senior Research Engineer in the Polymer Joining Team in Singapore Institute of Manufacturing Technology (SIMTech). He graduated from the Nanyang Technological University in 2010 with a degree in Chemical and Biomolecular Engineering. His work in SIMTech involves the development on plastic joining technologies for industry partners, focusing on plastic laser welding for process productivity, thermal bonding of thermoplastic polymers, and development of pressure sensitive adhesive (PSA) that is derived from bio-materials. In addition, various surface treatment technologies, such as the use of plasma, corona, adhesion promoter, primers, and interlocking mechanical features, have been investigated and developed for adhesion enhancement of joint-strength and reliability.
Plastic laser welding, Bio-adhesive development.
2010, Bachelor of Engineering (Chemical & Biomolecular Engineering) (Honours)
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