Researcher Portfolio

Kok Eugene (Mr)
Senior Research Engineer I
6590 3171
Joining Technology

Mr Eugene Kok is a Senior Research Engineer in the Polymer Joining Team in Singapore Institute of Manufacturing Technology (SIMTech). He graduated from the Nanyang Technological University in 2010 with a degree in Chemical and Biomolecular Engineering. His work in SIMTech involves the development on plastic joining technologies for industry partners, focusing on plastic laser welding for process productivity, thermal bonding of thermoplastic polymers, and development of pressure sensitive adhesive (PSA) that is derived from bio-materials. In addition, various surface treatment technologies, such as the use of plasma, corona, adhesion promoter, primers, and interlocking mechanical features, have been investigated and developed for adhesion enhancement of joint-strength and reliability.

Research Interest:

Plastic laser welding, Bio-adhesive development.


2010, Bachelor of Engineering (Chemical & Biomolecular Engineering) (Honours)

  • E. Kok, S. P. Ng, C. L. Tham and H. M. Chong, "Bio-Derived Pressure Sensitive Adhesives with High Renewable Content", ICMAT 2017, 18-Jun-2017 to 23-Jun-2017, Suntec Singapore,
  • H. M. Chong, A. S. Subramanian, S. P. Ng, E. Kok and S. Feih, "Effect of laminate b-staging on out-of-autoclave composite repair", International Conference on Composite Materials (ICCM), 20-Aug-2017 to 25-Aug-2017, Xi'an Qujiang International Conference and Exhibit
  • X. N. Ho, H. J. Lu, W. Liu, J. N. Tey, C. K. Cheng, E. Kok and J. Wei, "Electrical and Optical Properties of Hybrid Transparent Electrodes That Use Metal Grids and Graphene Films", Journal of Materials Research, vol. 28(4), pp. 620-626 (FEB-2013)