Introduction:After working in the electronics industry for 12 years, Chua Kai Meng joined SIMTech. Currently, he is a Research Fellow in Microfluidics Manufacturing Programme of SIMTech. He has over 10 years of experience in R&D for the electronics industry, in the area of electronic packaging, Hybrid Thick Film, wafer bumping and SMT.
Recent industry projects:
· LTCC development
· Lead-Free Consortium
· Flip Chip Consortium
Research Interest:Electronics packaging technology, hybrid thick film manufacturing, SMT assembly, wafer bumping and reliability analysis
BioNotes:BSc (Nanyang University, 1980)
MSc (Nanyang Technology University, 1997)
1. Z.P Wang, Y.M. Tan, K.M.Chua, Vern Solberg,"Failure Analysis and Reliability Assessment of MicroBGA TV46", Chip Scale International 99.
2. Z.P. Wang, Y.M.Tan, K.M.Chua, "Reliability Assessment of Flex Interposer Chip Scale Packages", APACK '99.
3. Z.P.Wang, D.J.Xie, and K.M.Chua, " Interconnect Design and Reliability of Land Grid Array CSPS", SMTA International '99 / Chip Scale International '99.
4. Z.P.Wang, Y.M.Tan, K.M.Chua, "Board Level Reliability of Chip Scale Packages", 31st International Symposium on Microelectronic.