Researcher Portfolio

Ng Shu Pei (Ms)
Research Engineer
+65 6590 3176
Joining Technology
Introduction:

Ms Ng Shu Pei is a Research Engineer with SIMTech. Her research areas include solvent and thermal joining for polymeric microfluidics, surface modification for adhesion improvement and advanced adhesive characterisation. She received her Master’s Degree in Material Engineering from Katholieke Universiteit Leuven, Belgium in 2007. Prior to joining SIMTech, Shu Pei worked in industry in the areas of adhesive product development.

Research Interest:
  • Development of solvent bonding and thermal bonding process for polymers in emerging applications
  • Development of surface modification for adhesion improvement 
Publications:
  • S. Z. Yu, S. P. Ng, Z. F. Wang, C. L. Tham and Y. C. Soh, “Thermal bonding of thermoplastic elastomer film to PMMA for microfluidic applications”, Surface & Coatings Technology 320, pp. 437-440 (2017)
  • H. M. Chong, A. S. Subramanian, S. P. Ng, E. Kok and S. Feih, "Effect of laminate b-staging on out-of-autoclave composite repair", International Conference on Composite Materials (ICCM), 20-Aug-2017 to 25-Aug-2017, Xi'an Qujiang International Conference and Exhibit
  • E. Kok, S. P. Ng, C. L. Tham and H. M. Chong, "Bio-Derived Pressure Sensitive Adhesives with High Renewable Content", ICMAT 2017, 18-Jun-2017 to 23-Jun-2017, Suntec Singapore
  • S. P. Ng, F. E. Wiria and N. B. Tay, “Low Distortion Solvent Bonding of Microfluidic Chips”, Procedia Engineering 141, pp. 130-137 (2016)