Thin Film Deposition and Patterning: Conventional thin film patterning for integrated chip is adopted with special considerations to the polymeric substrates. We have developed special coatings and procedures to ensure good adhesion. Fine metallic lines with 10µm width can be consistently fabricated with high quality using this technique.
Electroplating: Thick metallic film is deposited via electroplating technology. Using conventional lithographic technique, fine lines with 10µm width can be achieved.
Screen Printing: The SMF has implemented screen printing technique as a cost-effective metallisation process for polymer microfluidic devices. By transferring conductive paste onto the substrate through patterned stencil, metallic lines with width as small as 100 µm can be fabricated.
Thin Film Sputtering