One-Shot 3D Microscope

Instant 3D imaging for semiconductor manufacturing
Semiconductor manufacturing requires fast, reliable inspection of micro-scale features, yet traditional 3D microscopes rely on Z-scanning that slows inspection, increases mechanical complexity, and creates motion blur.
The One-Shot 3D Microscope, created by A*STAR Singapore Institute of Manufacturing Technology and commercialised by JM VisTec, introduces a new optical solution. A specially designed chromatic lens splits light into colours, with each colour focused at a different depth. This allows the entire 3D surface to be reconstructed from a single exposure, removing the need for scanning.
It is the only known system that delivers full-field, area-based 3D capture in one shot. This makes it faster, simpler, and more stable than existing solutions, while maintaining micron-level accuracy. Its design is ideal for wafer profiling, micro-bump height measurement, integrated circuit surface checks, and inline metrology for process monitoring.
The system is built to cut inspection time, increase throughput and scale for production use. Homegrown innovation is moving from research to industry, strengthening the future of advanced manufacturing.
Additive Manufacturing Digital Twin (AM-DT)
Predicting quality in 3D-printed metal parts
Metal additive manufacturing (AM) offers great design freedom, but ensuring consistent quality remains a challenge. Manufacturers often face issues such as porosity, warping, and variable microstructures that limit wider adoption.
The Additive Manufacturing Digital Twin (AM-DT), developed by A*STAR’s Institute of High Performance Computing (IHPC) with contributions from Singapore Institute of Manufacturing Technology (SIMTech), Institute of Materials Research and Engineering (IMRE), and the National Metrology Centre (NMC), addresses these challenges. This software uses advanced physicsbased modelling to simulate the AM process and predict the quality of 3D-printed metal parts.
By combining powder-scale and part-scale modelling, AM-DT can anticipate issues such as porosity, distortion, microstructural changes, and final mechanical properties before production begins. This reduces trial-and-error, lowers development costs, and shortens the path from design to production-ready parts.
Deployed at the Additive Innovation Centre and tested with industry users, AM-DT gives manufacturers greater confidence in adopting metal AM. As a Singapore-developed solution, it also supports broader industry adoption and strengthens the local additive manufacturing ecosystem.
Paeonia Innovations: Compact Mid-Infrared Spectrometer for Instant Chemical Analysis

Chemical Intelligence Unleashed
Real-time monitoring of chemical composition has long been a challenge, restricted by bulky and fragile equipment, environmental effects, integration complexity, and slow data feedback. Paeonia Innovations addresses this with a compact, easy-to-use mid-infrared spectrometer that brings powerful chemical intelligence to the palm of your hand.
The device delivers updates every 0.3 seconds with high signal-to-noise accuracy, making it ideal for inline monitoring of reactions, residence time distribution, and other process parameters. Its small footprint and plug-and-play integration allow manufacturers to deploy it on-site or directly into production lines.
Founded in 2023 as a spin-off from A*STAR Institute of Microelectronics, Paeonia Innovations has since expanded globally, with its technology adopted in industries ranging from fuels to pharmaceuticals such as in Pharma Innovation Programme Singapore.
Through the Technology for Enterprise Capability Upgrading (T-Up) programme, Paeonia collaborated with an A*STAR secondee to speed up product development. The secondee later received the TUp Emerging Talent Award, a recognition of the talent that has contributed directly to advancing the company’s innovation.
Zincode Technologies: FlexSys Inspection Platform for Complex Components

Modular robotics and AI for faster, more accurate inspections
Zincode Technologies delivers automation and inspection systems for industries where accuracy and reliability are vital, including aerospace, medical devices, and high-mix electronics.
In partnership with A*STAR Advanced Remanufacturing and Technology Centre through the Technology for Enterprise Capability Upgrading (T-Up) programme, Zincode created the FlexSys Unified Robotic Inspection Platform. T-Up seconds researchers to enterprises, strengthening R&D and accelerating innovation.
FlexSys combines modular robotics, adaptive grippers, multi-mode lighting, 3D point-cloud measurement, and AI-driven defect detection in a single platform—applying human-level decision logic executed by robots to deliver consistent results on irregular, high-value parts. In pilot deployments, the system reduces inspection cycle time by up to 40%, improves repeatability, and offers reconfigurable inspection “recipes” with digitised reporting workflows.
FlexSys provides a practical path to faster, more consistent inspections, helping industries improve efficiency and confidence in automated quality assurance.