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A*STAR and Soitec Launch Joint Program to Develop a New Layer Transfer Process for Advanced Packaging                    
 
SOITEC and A*STAR's IME launch joint program to develop a new Layer Transfer Process for Advanced Packaging - New cost competitive wafer-to-wafer layer transfer process delivers low power, increased yield and higher interconnection density and speed. Read more

 

For this and other news on IME's LinkedIn page, click here.


           

 
 

  A*STAR INSTITUTE OF MICROELECTRONICS
2
Fusionopolis Way, #08-02 Innovis, Singapore 138634

Tel: (65) 6501 1800  I  E-mail: enquiry@ime.a-star.edu.sg           


      

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