Advanced Packaging

Advanced packaging at IME is driven by the needs of local & global industry partners to design, demonstrate and prototype novel packages to meet market requirements in hyper-scale data centre, AI, 5G and Automotive applications. 

Through Advanced packaging IME integrates heterogeneous chiplets to provide power, performance, formfactor, cost optimized System-in-Package solutions such as wafer level Package-on-Package, 3D stacked memory, Antenna-in-package, co-packed optics, intelligent power modules.

IME’s heterogenous integration pilot line allows diverse chiplets to be integrated in state-of-the-art advanced packages. Our technologies include high density fan-out wafer level packaging, 2.5D interposers, 3D TSV, C2W/W2W hybrid bonding. 

IME’s system-in-package designs are realized by our verified PDKs and optimized through accurate multi-physics modelling to produce packages that have strong mechanical, thermal, and electrical integrity.