Packaging Design & Fabrication Services
IME offers a wide range of advanced packaging technology solutions to address the above industry needs. Our platforms include 2.5D through-silicon interposer, 3D TSV, fan-out wafer level packaging, MEMS wafer level chip-scale packaging, fine-pitch Cu pillar, chip-on-wafer (direct Cu-to-Cu) bonding, electronic-photonic integration, as well as thermal solutions.
We are searching for individuals who dare push the boundaries of science and technology.
If you know of brilliant minds in your midst, nominate them now for the nation’s highest honour in Science and Technology – The
President’s Science and Technology Awards 2022.
Nominations close on 17 May 2022.