Packaging Design & Fabrication Services

IME offers a wide range of advanced packaging technology solutions to address the above industry needs.  Our platforms include 2.5D through-silicon interposer, 3D TSV, fan-out wafer level packaging, MEMS wafer level chip-scale packaging, fine-pitch Cu pillar, chip-on-wafer (direct Cu-to-Cu) bonding, electronic-photonic integration, as well as thermal solutions. 

Services & Facilities

Multi-Chip 12 inch FOWLP Development line

One-Stop Solution

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