At IME, we offer end-to-end solutions in FOWLP & 2.5D/3D packaging and shorten the development cycle time for new applications. We also offer services in the area of wafer level fine pitch RDL of 2um/2um LW/LS, C4 solder bumping & Cu pillar micro bumping up to 20um pitch, temporary bonding & de-bonding, TSV fabrication etc.
IME’s full fledge of development line comprises state-of-the-art tools including :
- PVD chamber for seed layer deposition,
- PR track for photoresist coating and photo-dielectric coating,
- Stepper for lithography,
- Developer track, plating
- Wet bench for PR stripping
- Spray etcher for seed etching
- Furnace for curing
- Descum/etch
- Flip-chip bonder for chip-to-wafer bonding
- Molding tool for wafer level compression
- Warpage adjuster for molding tape de-bonding and warpage adjustment
- Backgrinder for wafer thinning
- Laser de-bonder for carrier de-bonding
- Solder jetter for solder ball attach
- Wafer dicer for wafer sawing