There are increasing technology demand in the automotive industry for Advanced driver-assistance systems (ADAS) for Adaptive Cruise Control, Lane Change Assist, Automatic Emergency Brake and Forward Collision Avoidance etc. ADAS relies on inputs from multiple systems, such as automotive imaging, LiDAR, V2V/V2X communication and RADAR.Currently the industry has widely adopted 77Ghz for the RADAR frequency for 30 to 250 meters range and 79GHz shall be adopted by the industries for mid to short range detection. To ensure reliable and high performance for the 77GHz/79GHz RADAR at millimetre wavelength, IME proposes the use of Fan-Out Wafer Level Packaging (FOWLP) which has several key advantages such as low dielectric loss, shorter interconnects length, excellent impedance matching, higher Q inductance, significant reduction in cost/size and many more.
IME offers a variety of TSV processes like TSV backside reveal, Via-Middle, Via-Last TSVs fabrication. We have state-of-the-art advanced packaging tools to support TSV aspect ratio of up to 20:1. Depending on the requirement, via-last TSV can be implemented from either the frontside or backside of the wafer.
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