Publications

Thin Sc0.2Al0.8N Film Based 15GHz Wideband Filter: Towards mmWave Acoustic Filters

Authors’ List: Wang Xinghua, Liu Chen, Zhang Ying, Yang Wenjia, Qian You, Liu Peng Patrick, Quek Zhan Jiang, Hong Yan, Eugene Woo Yi Zhun, Lin Huamao, Zhang Qing Xin, Peter Chang Hyun Kee, Zhu Yao

Conference Name: 2023 International Electron Devices Meeting (IEDM)

DOI Number: 10.1109/IEDM45741.2023.10413706

Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling

Authors’ List: Surya Bhattacharya, Vempati Srinivasa Rao

Conference Name: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

DOI Number: 10.23919/VLSITechnologyandCir57934.2023.10185396

A Sc0.2Al0.8N-based 14 GHz Film Bulk Acoustic Resonator with over 8% Coupling Coefficient and over 400 Quality factor for Ku-band applications

Authors’ List: Liu Chen, Wang Xinghua, Yang Wenjia, Zhang Ying, Eugene Woo Yi Zhun, Zhu Yao

Conference Name: 2023 IEEE International Ultrasonics Symposium (IUS)

DOI Number: 10.1109/IUS51837.2023.10306371

Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding

Authors’ List: Varsala Nagendra Sekhar, Mishra Dileep, Lianto Prayudi, Chong Ser Choong, Vempati Srinivasa Rao
Conference Name: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)DOI Number: 10.1109/ECTC51909.2023.00100

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Authors’ List: Sajay B G, Lau Boon Long, Seit Wen Wei, Jong Ming Chinq, David Ho Soon Wee, Wu Jiaqi, Lim Teck Guan, Chong Ser Choong, Chia Lai Yee, Surya Bhattacharya
Conference Name: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
DOI Number: 10.1109/ECTC51909.2023.00043

Sputtered PZT pMUT with Bias-Tunable Electromechanical Coupling Coefficient for Air-coupled Ranging Applications

Authors’ List: Liu Jihang, David Choong Sze Wai, Goh Duan Jian, Merugu Srinivas, Zhang Qin Xin, Peter Chang Hyun Kee, Alberto Leotti, Tan Hwei Sze, Adriyan Hidayat Mohamed Hamsah, Sagnik Ghosh, Prakasha Chigahalli Ramegowda, Daniel Chen, Domenico Giusti, Fabio Quaglia, Claudia Pedrini, Luca Barabani, Laura Castoldi, Lee En-Yuan Joshua
Conference Name: 2022 IEEE International Ultrasonics Symposium (IUS)
DOI Number: 10.1109/IUS54386.2022.9958698

NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging

Authors’ List: Chou Teyuh, Wei Tang, Mihai Dragos Rotaru, Chester Liu, Dutta Rahul, Sharon Lim Pei Siang, Surya Bhattacharya
Conference Name: 2022 IEEE Symposium on VLSI Technology and Circuits
DOI Number: 10.1109/VLSITechnologyandCir46769.2022.9830249

3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer

Authors’ List: Zhang Ying, Wang Xinghua, Liu Chen, Eugene Woo Yi Zhun, Yang Wenjia, Zhang Qing Xin, Yan Dan Lei, Raja Muthusamy Kumarasamy, Chen Bangtao, Wang Nan, Zhu Yao
Conference Name: IEDM 2022: 68th Annual IEEE International Electron Devices Meeting
DOI Number: 10.1109/IEDM45625.2022.10019557

Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

Authors’ List: Surya Bhattacharya, Lim Teck Guan, David Ho Soon Wee, Chui King Jien, Zhang Xiaowu, Mihai Dragos Rotaru, Sajay B G, Chai Tai Chong, Chong Ser Choong, Li Hongyu, Sharon Lim Pei Siang, Wang Xiangyu, Jong Ming Chinq, Varsala Nagendra Sekhar, Dutta Rahul, Vempati Srinivas Rao
Conference Name: IEDM 2022: 68th Annual IEEE International Electron Devices Meeting
DOI Number: 10.1109/IEDM45625.2022.10019429

Development of Advanced Liquid Cooling Solution on Data Centre Cooling

Authors’ List: Zhang Xiaowu, Han Yong, Tang Gongyue, Chen Haoran, Lau Boon Long
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00265

Design of Compact Microwave Multiplexer for RF Reflectometry Characterization of Silicon-Based Spin Qubits

Authors’ List: Vignesh Shanmugam Bhaskar, Mihai Dragos Rotaru
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00156

Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Applications

Authors’ List: Vignesh Shanmugam Bhaskar, Jong Ming Chinq, Kazunori Yamamoto, Tang Gongyue
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00320

Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module

Authors’ List: Tang Gongyue, Kazunori Yamamoto
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00093

FOWLP AiP for SOTM Applications

Authors’ List: Sun Mei, Lim Teck Guan, Han Yong
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00065

Publications

A*STAR celebrates International Women's Day