NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging Authors’ List: Chou Teyuh, Wei Tang, Mihai Dragos Rotaru, Chester Liu, Dutta Rahul, Sharon Lim Pei Siang, Surya Bhattacharya
Conference Name: 2022 IEEE Symposium on VLSI Technology and Circuits
DOI Number: 10.1109/VLSITechnologyandCir46769.2022.9830249 |
3D Monolithic Integration of ScAlN-based GHz MEMS Acoustic Filters on 200mm RFSOI Wafer Authors’ List: Zhang Ying, Wang Xinghua, Liu Chen, Eugene Woo Yi Zhun, Yang Wenjia, Zhang Qing Xin, Yan Dan Lei, Raja Muthusamy Kumarasamy, Chen Bangtao, Wang Nan, Zhu Yao
Conference Name: IEDM 2022: 68th Annual IEEE International Electron Devices Meeting
DOI Number: 10.1109/IEDM45625.2022.10019557 |
Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets Authors’ List: Surya Bhattacharya, Lim Teck Guan, David Ho Soon Wee, Chui King Jien, Zhang Xiaowu, Mihai Dragos Rotaru, Sajay B G, Chai Tai Chong, Chong Ser Choong, Li Hongyu, Sharon Lim Pei Siang, Wang Xiangyu, Jong Ming Chinq, Varsala Nagendra Sekhar, Dutta Rahul, Vempati Srinivas Rao
Conference Name: IEDM 2022: 68th Annual IEEE International Electron Devices Meeting
DOI Number: 10.1109/IEDM45625.2022.10019429 |
Development of Advanced Liquid Cooling Solution on Data Centre CoolingAuthors’ List: Zhang Xiaowu, Han Yong, Tang Gongyue, Chen Haoran, Lau Boon Long
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00265 |
| Design of Compact Microwave Multiplexer for RF Reflectometry Characterization of Silicon-Based Spin Qubits Authors’ List: Vignesh Shanmugam Bhaskar, Mihai Dragos Rotaru
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00156 |
| Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Applications Authors’ List: Vignesh Shanmugam Bhaskar, Jong Ming Chinq, Kazunori Yamamoto, Tang Gongyue
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00320 |
| Static/Transient Thermal Analysis and Design Optimization of a Lead Frame Based Dual Side Cooling SiC Power Module Authors’ List: Tang Gongyue, Kazunori Yamamoto
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00093 |
| FOWLP AiP for SOTM Applications Authors’ List: Sun Mei, Lim Teck Guan, Han Yong
Conference Name: ECTC 2022: IEEE Electronic Components and Technologies Conference
DOI Number: 10.1109/ECTC51906.2022.00065 |