MDRA has the capabilities and cutting edge facilities to conduct world-class research and development in semiconductor manufacturing and technology. We provide materials and process characterization, failure analysis and reliability test to support our industry partners in wafer fabrication, packaging, assembly and test.
Structure analysis Capabilities
- CM200 TEM and Titan MSTEM
- Focus Ion Beam (FIB)
- SEM with EDX and EBSD
- Sample preparation (Micro clever, Ion milling and polishing machines)
- Confocal Scanning Acoustic Microscopy (CSAM)
Surface analysis Capabilities
- Electron Spectrum Scope
- Atomic Force Microscopy (AFM)
Environmental Reliability Testing
- High Temperature Storage (HTS)
- Thermal Cycling
- HAST
- Temp-Humidity storage
Electrical Testing
- ESD Testing: Human Body Model & Machine Model
- Probe Stations