R&D Foundry

wafer fab

Fab Services

IME offers advanced lithography services printing 45nm and above patterns for 300mm wafers using immersion lithography. Defect inspection capability for 30nm above pattern defects, surface defects, advanced overlay and CD measurement are also available.  

Lithography

  • 365nm Stepper
  • 193nm Immersion Scanner

Physical Vapor Deposition

  • Cu
  • Al 
  • Ti / TiN

Atomic Layer Deposition

  • HfO/ HfN
  • Al2O3

Chemical Vapor Deposition 

  • Silicon Nitride
  • Silicon Oxide

Bonding

  • Temporary / Permanent
  • Fusion
  • Polymer
  • Hybrid
  • Metal

Metrology

  • Macro & Micro Defect Review and Binning
  • Defect review SEM
  • Sidewall Roughness
  • Surface Morphology
  • Film Stress / Warpage
  • Thickness Measurements

Electroplating (ECP)

  • Cu Pillar, RDL, UBM
  • TSV Cu

Furnace

  • Anneal
  • Polymide, Dielectric Cure

Etch

  • Descum
  • Silicon
  • Oxide
  • Silicon-Nitride

Customized Solutions 

  • Specialty CVD / PVD Depositions
  • New Materials Evaluations
  • Deep Machines Learning Applications

Material, Device, Reliability Analysis (MDRA)

MDRA has the capabilities and cutting edge facilities to conduct world-class research and development in semiconductor manufacturing and technology. We provide materials and process characterization, failure analysis and reliability test to support our industry partners in wafer fabrication, packaging, assembly and test.

Structure analysis Capabilities

  • CM200 TEM and Titan MSTEM
  • Focus Ion Beam (FIB)
  • SEM with EDX and EBSD
  • Sample preparation (Micro clever, Ion milling and polishing machines)
  • Confocal Scanning Acoustic Microscopy (CSAM)

 Surface analysis Capabilities

  • Electron Spectrum Scope
  • Atomic Force Microscopy (AFM)

 Environmental Reliability Testing

  • High Temperature Storage (HTS)
  • Thermal Cycling
  • HAST 
  • Temp-Humidity storage

Electrical Testing

  • ESD Testing: Human Body Model & Machine Model
  • Probe Stations

FAB Capabilities

Etch

  • Etching processes on 200 and 300 mm wafers
  • Cavities with depth up to 500 µm
  • Vias and trenches with depth up to 100 µm, aspect ratio ≥ 10:1
  • Silicon and SiN pillars with minimal dimensions of 60nm
  • SiO2 and SiN based dielectrics of different thicknesses and critical dimensions with controllable sidewall angle
  • Metal etch

Lithography

  • Capable of 45nm line/space resolution
  • Advanced Packaging applications, capable of 1um resolution, 200mm & 300mm thinned and warped wafer handling
  • 200mm i-line stepper for MEMS applications, capable of 0.5um resolution with front to back alignment

In-Line Metrology

  • 8” or 12” Metrology measurement services available for Defect Review, Defect Binning, Particle count, Film Thickness (Metal / Non-Metal) and Critical Dimension measurement
  • Atomic Force for surface roughness measurement
  • TSV Metrology

Thin Film

  • Physical vapour deposition (PVD), chemical vapour deposition (CVD), atomic layer deposition (ALD) and electroplating (ECP) services available 
  • Silicon wafers bonding service is also available for 12” and 8” wafers 
 

Locations of IME Cleanrooms:

  • 11 Science Park Road, Singapore Science Park II, Singapore 117685
  • 6 Fusionopolis Way Synthesis Building Level 2, 4 and 5, Singapore 138636

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