IME has state of the art 300mm advanced wafer level packaging engineering line which can support various advanced wafer level packaging technologies development such as Mold-First and RDL-First FOWLP, Passive and Active Interposers for 2.5D and Via-Middle & Via-Last TSV integration for 3D IC packaging etc used in mobile, AI, Data Centre and IoT applications. IME offer end-to-end solutions in FOWLP & 2.5D/3D packaging and shorten the development cycle time for new applications. We also offer services in the area of wafer level fine pitch RDL of 2um/2um LW/LS, C4 solder bumping & Cu pillar micro bumping up to 20um pitch, temporary bonding & de-bonding, TSV fabrication etc.
IME Multi-Chip 12" FOWLP Development Line