Heterogeneous Integration

Heterogeneous Integration (HI) group uses advanced packaging platform to integrate devices in order to resolve device scaling issues predicted by Moore’s law. HI is essential to sustain and further enhance the pace of progress with higher performance, lower latency, smaller form factor, lighter weight, lower power requirement per function and lower cost. Targeted end applications include mobile, 5G, data centres, automotive, IOT etc. Supported by 300 mm Advanced Packaging Development line and Assembly lab, HI group provides system level packaging solutions to industry partners through R&D pilot run, service jobs, small volume production and technology transfer for high-volume production.


Fan-out Wafer Level Packaging (FOWLP) for Automotive mmWave Antenna-in-Package

 FOWLP
Cross-sectional view of RDL-first FOWLP.
   There are increasing technology demand in the automotive industry for Advanced driver-assistance systems (ADAS) for Adaptive Cruise Control, Lane Change Assist, Automatic Emergency Brake and Forward Collision Avoidance etc. ADAS relies on inputs from multiple systems, such as automotive imaging, LiDAR, V2V/V2X communication and RADAR.
Currently the industry has widely adopted 77Ghz for the RADAR frequency for 30 to 250 meters range and 79GHz shall be adopted by the industries for mid to short range detection. To ensure reliable and high performance for the 77GHz/79GHz RADAR at millimetre wavelength, IME proposes the use of Fan-Out Wafer Level Packaging (FOWLP) which has several key advantages such as low dielectric loss, shorter interconnects length, excellent impedance matching, higher Q inductance, significant reduction in cost/size and many more. 

Fan-out Wafer Level Packaging (FOWLP) for 5G mmWave Antenna-in-Package

Antena-in-Package Cross section of FOWLP mmWave AiP.   5G base stations require proper integration of the Power Amplifier (PA) chips,  millimetre wave monolithic ICs (MMIC), passive components and millimetre wave (mmWave) antenna array to support high speed and large bandwidth communication. However, to ensure lower electrical losses,  tighter process controls are required to ensure proper matching as a manufacturing requirement to the 5G base station modules. 
To tackle these issues, IME proposes the use of Fan-Out Wafer Level Packaging (FOWLP) which allows 3D integration of the mmWave phase array antennas on top of the RF ICs within a single package. This allows components to be closely connected and ensure minimum interconnection losses. Wafer level packaging shall be used to further reduce parasitic losses and ensure adequate impedance matching. 3D FOWLP integration further allows a scalable sub-array AiP to be formed which subsequently is then used to realize the larger antenna array. 

Wafer Level Packaging

IME has state of the art 300mm advanced wafer level packaging engineering line which can support various advanced wafer level packaging technologies development such as Mold-First and RDL-First FOWLP, Passive and Active Interposers for 2.5D and Via-Middle & Via-Last TSV integration for 3D IC packaging etc used in mobile, AI, Data Centre and IoT applications. IME offer end-to-end solutions in FOWLP & 2.5D/3D packaging and shorten the development cycle time for new applications. We also offer services in the area of wafer level fine pitch RDL of 2um/2um LW/LS, C4 solder bumping & Cu pillar micro bumping up to 20um pitch, temporary bonding & de-bonding, TSV fabrication etc.

IME Multi-Chip 12" FOWLP Development Line

Wafer Level Packaging Line
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