Heterogeneous Integration

Heterogeneous Integration (HI) group uses advanced packaging platform to integrate devices in order to resolve device scaling issues predicted by Moore’s law. HI is essential to sustain and further enhance the pace of progress with higher performance, lower latency, smaller form factor, lighter weight, lower power requirement per function and lower cost. Targeted end applications include mobile, 5G, data centres, automotive, IOT etc. Supported by 300 mm Advanced Packaging Development line and Assembly lab, HI group provides system level packaging solutions to industry partners through R&D pilot run, service jobs, small volume production and technology transfer for high-volume production.

Fan-out Wafer Level Packaging (FOWLP) for Automotive mmWave Antenna-in-Package

Fan-out Wafer Level Packaging (FOWLP) for 5G mmWave Antenna-in-Package

Wafer Level Packaging

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