Hyperscale Data Centers (HDC) drive the need to bring Optical Interconnects to the Rack and Server. Silicon Photonics has the capability of bringing Optical interconnects in optimal formfactor to the rack and server layers of a HDC. However, this requires novel electronic-photonic heterogeneous integrated packaging that allows hundreds of optical channels to be connected to Photonic and Electronic ICS and routed in and out of servers and respective racks.
IME is building electronic photonic heterogeneous integration platform based on our broad experience in Advanced Wafer Level Packaging including TSV, Through-Si-Interposers, Active Interposers, Fan-Out WLP, 3D Stacking, C2W. The goal of this platform is to enable sub-pj/bit energy consumption in HDC, HPC interconnects, and low-cost solutions for optical sensing applications. The packaging platform will allow significantly improved performance at drastically lower power dissipation in pluggable transceivers, On-board-Optics, and in Co-Packaged Optical Engines.