Institute of Microelectronics Activities
Advanced Packaging Consortium Event
10 May 2024
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We are honoured to host our Advanced Packaging Industry Event. Dr. Raja Swaminathan, CVP from AMD shared about the potential of 3D architectures to advance AI performance and efficiencies. Dr. Radha Nagarajan, SVP & CTO from Marvell Technology explored the realm of Heterogeneous Integration for optical interconnects, showcasing breakthrough technologies. Institute of Microelectronics' Dr Surya Bhattacharya and Mr Srinivasa Rao Vempati also shared on our 2 upcoming Advanced Packaging consortiums as well.
Posted in: IME Happenings
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