We are pleased to announce the launch of our ‘Advanced System-In-Package enabled by Heterogeneous Integration of HPC and Photonics Chiplets Consortium’ (CHIPLETS).

With the rise of Generative AI, the need for faster, more efficient computing is greater than ever. Our consortium aims to create a cutting-edge heterogeneous integration platform that integrates compute, memory, and Optical I/O chiplets from various technologies. This innovative approach overcomes the limitations of traditional system-on-chip (SoC) designs, delivering smaller, more powerful packages that boost efficiency in power, performance, and cost—perfect for AI applications with high compute needs.