AIC houses a comprehensive suite of integrated end-to-end additive manufacturing facilities, as a one-stop hub for the research innovation of industry-ready solutions. In addition to typical AM machines, below are some specialised equipment available at AIC:

EOS M400
Equipment: EOS M400
Technology: Laser Powder Bed Fusion
Printing Envelope: 400 x 400 x 400 mm3

EOS M290
Equipment: EOS M290
Technology: Laser Powder Bed Fusion
Printing Envelope: 250 x 250 x 325 mm3

Equipment: ARCAM A2X
Technology: Electron Beam Melting
Printing Envelope: 200 x 200 x 380 mm3

ExOne M-Flex
Equipment: ExOne M-Flex
Technology: Binder Jet Printing
Printing Envelope: 400 x 250 x 250 mm3

ExOne Innoventplus
Equipment: ExOne Innoventplus
Technology: Binder Jet Printing
Printing Envelope: 160 x 65 x 65 mm3 (for fine powder <10μm)

Stratasys 450mc
Equipment: Stratasys 450mc
Technology: Fused Deposition Modeling
Printing Envelope: 406 x 355 x 406 mm3

Essentium HSE 180-HT
Equipment: Essentium HSE 180-HT
Technology: Fused Filament Fabrication
Printing Envelope: 690 x 500 x 600 mm3

EOS P395
Equipment: EOS P395
Technology: Selective Laser Sintering
Printing Envelope: 340 x 340 x 620 mm3

Equipment: Hybrid Laser Aided AM (LAAM)
Technology: Hybrid DED
Printing Envelope: 200mm ⌀ X 500 mm
Remarks: Large format printing

Equipment: TPS 400i PULSE Wire Arc AM (WAAM)
Technology: Direct Energy Deposition
Printing Envelope: 250mm ⌀ X 800 mm 
Remarks: Large format printing

VIGA2B with EIGA Option
Equipment: VIGA2B with EIGA Option
Technology: Vacuum-melting and Inert Gas Atomisation System
Printing Envelope: Particle size mass median diameter (40 - 80μm)