EPTC 2024

At EPTC 2024, held from 3–6 December, IME presented 46 papers, showcasing breakthroughs in areas such as machine learning for hybrid bonding, advancements in 2.5D and 3D interposers, and cryogenic packaging solutions for quantum technologies.

Additionally, our team actively participated in the Heterogeneous Integration Roadmap Workshop, with Mr. Vempati Srinivasa Rao (Packaging department) delivering a session on energy-efficient AI hardware and its impact on advanced packaging interconnects. Dr. Carlos Mazure joined as a panelist, while Dr. Surya Bhattacharya (Packaging department) moderated the session, reinforcing IME's leadership in the packaging space.

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